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| Description |
| A Revolutionary Single Wafer Cleaning System, This system can choose faceup or facedown processing. The Spin processor supports a variety of cleaning processes including pre-process cleaning, oxide etching and post-process cleaning, and is ideal for small volume production of next generation devices. |
| Feature |
1. SEMI S2-0703 Qualified
2. GEM/SECS-Ⅱ available
3. Change Kit free Between 300mm & 200mm Wafer
4. Low Cost-of-Ownership
5. High productivity
6. Extensive applications
7. Chemical recycling available |
| Application |
1 Pre-diffusion cleaning
2 Photoresist stripping
3 Silicon oxide film etching
4 Metal etching
5 UBM etching
6 Metal Lift-off |
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